화살표

TDS

dTDS (Thermal Desorption Spectroscopy for Display Material)

디스플레이용 TDS는 Glass 재질 상의 유기박막 등의 분석이 가능하며, 형상에 따라 유연하게 샘플홀딩 및 로딩이 가능하도록 설계되었습니다.

Specification

· Sample Description : glasses up to 100 mm × 100 mm
· Mass Range : (1 ~ 200) amu
· IR Rod Heating : up to 900 ℃
· Base Pressure : *process chamber, < 5 × 10-7 mbar / *measurement chamber, < 1 × 10-9 mbar
· DAQ System : manual or automated fully, sampleloading to measurement through data analysis


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aTDS (Automated TDS for Semiconductor Wafer)

aTDS는 300mm 웨이퍼 분석에 있어 전자동화를 위해 EFEM, Wafer Transfer Robot와 함께 구성되어 있으며, 사용자 요구에 따라 100, 200, 300, 500 amu 등 QMS을 비롯한 다양한 옵션의 핵심 구성품으로 제공될 수 있습니다.

Specification

· Sample Size : 300 mm WAFER
· Halogen Lamp Heater
· up to 950℃
· High Vacuum with gold plated chamber
· Fully Automatic (EFEM/Aligner/WTR)


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TDS(Thermal Desorption Spectroscopy for Special Application)

그외 특수목적용도로 제작된 TDS 설비로써 외부 기관에서의 분석의뢰에 따라 정성+정량 분석한 시험 성적서를 제공합니다.
- Complex TDS
- SRM in distance, sample in large chamber TDS
- Varied sample features, user specified TDS in demand

User defined TDS Specification

· Sample Description : up to Ø30 mm × 50 mm
· Mass Range : (1 ~ 200) amu
· IR Rod Heating : up to 900 ℃
· Base Pressure : *process chamber, < 2 × 10-9 mbar / *measurement chamber, < 1 × 10-9 mbar
· DAQ System : manual, sample loading to measurement through data analysis
· System Design : user specified requirements


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Complex TDS Specification

· Sample Description : up to Ø20 mm × 50 mm
· Mass Range : (1 ~ 200) amu
· IR Rod Heating : up to 800 ℃
· Base Pressure : *process chamber, < 5 × 10-8 mbar
· DAQ System : manual, sample loading to measurement through data analysis


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