화살표

TDS

xTDS

300mm급 웨이퍼 불순물 정량분석용 클러스터형 분석장비

Applications

  • - Detection of Molecualr Contamination on 300 mm Wafer
  • - Qualitative & Quantitative Analysis of Molecular Species

Hardware

· Rapid Heating Module : 900 ℃, <60 ℃/s
· Local Heating Module : 1200 ℃, <60 ℃/min
· Pressure : 1E-5 mbar ~ 1E-10 mbar
· Mass-to-charge Ratio : 100 u, 200 u

Specification

· Wafer Size : 300 mm, two FOUP loaded
· Detection Limit : 2E-13 A ~ 1E-6 A
· Temperature Uniformity : <3 % at 1000 ℃
· Hydrogen Detection Limit : <1E-4 mg/kg
· Throughput :RH - 10 wpd, LH – 20 wpd

DAQ Configuration

  • - Qualitative Analysis
  • - Quantitative Analysis
  • - H2 QuantityTraceable to NIST Standards