CH
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- TDS
- etc
TDS
dTDS (Thermal Desorption Spectroscopy for Display Material)
用于显示的 TDS 可以分析玻璃和其他材料上的有机薄膜，其设计可根据几何形状灵活地固定和装载样品。
Specification
· Sample Description : glasses up to 100 mm × 100 mm
· Mass Range : (1 ~ 200) amu
· IR Rod Heating : up to 900 ℃
· Base Pressure : *process chamber, < 5 × 10-7 mbar / *measurement chamber, < 1 × 10-9 mbar
· DAQ System : manual or automated fully, sampleloading to measurement through data analysis
aTDS (Automated TDS for Semiconductor Wafer)
aTDS 配有 EFEM 和 Wafer Transfer Robot，可实现 300 毫米晶圆分析的全自动化，并可根据用户需求，作为包括 QMS 在内的各种选件的核心组件提供 100、200、300 和 500 amu 的 QMS。
Specification
· Sample Size : 300 mm WAFER
· Halogen Lamp Heater
· up to 950℃
· High Vacuum with gold plated chamber
· Fully Automatic (EFEM/Aligner/WTR)
TDS(Thermal Desorption Spectroscopy for Special Application)
其他专门建造的 TDS 设施可根据外部分析要求提供定性和定量测试报告。
- Complex TDS
- SRM in distance, sample in large chamber TDS
- Varied sample features, user specified TDS in demand
User defined TDS Specification
· Sample Description : up to Ø30 mm × 50 mm
· Mass Range : (1 ~ 200) amu
· IR Rod Heating : up to 900 ℃
· Base Pressure : *process chamber, < 2 × 10-9 mbar / *measurement chamber, < 1 × 10-9 mbar
· DAQ System : manual, sample loading to measurement through data analysis
· System Design : user specified requirements
Complex TDS Specification
· Sample Description : up to Ø20 mm × 50 mm
· Mass Range : (1 ~ 200) amu
· IR Rod Heating : up to 800 ℃
· Base Pressure : *process chamber, < 5 × 10-8 mbar
· DAQ System : manual, sample loading to measurement through data analysis
