WCS-M300 utilizes ICP-MS(Inductively Coupled Plasma Mass Spectrometry)
for further detecting and characterizing metal trace on wafer surface.
·Agilent sensor used
(others sensors can be adopted).
·Inductively coupled plasma
ionizes the sample.
·Metal contaminant detection can detect
down to one part per trillion
atoms/cm2 on 300mm wafer
·Survey Limit-over 60 elements
in a single survey.