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WCS (Wafer Contamination Scanner)M300

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WCS (Wafer Contamination Scanner)M300

WCS-M300 utilizes ICP-MS(Inductively Coupled Plasma Mass Spectrometry)
for further detecting and characterizing metal trace on wafer surface.

¡¤Agilent sensor used
(others sensors can be adopted).
¡¤Inductively coupled plasma
ionizes the sample.
¡¤Metal contaminant detection can detect
down to one part per trillion
¡¤Detection Limit-1X107
atoms/cm2 on 300mm wafer
¡¤Survey Limit-over 60 elements
in a single survey.

  • Scanning

  • ¥í Applicable wafer materials
  • ¡¤extended applicability to various materials by patented scan nozzle system
  • ¡¤very hydrophobic ~ hydrophilic surface
  • ¡¤possible to scan patterned wafers and glasses
  •  
  • ¥í Scan mode
  • ¡¤full, radial, edge scan and point scan
  • ¡¤wafer rotation & nozzle linear motion

Performance

  • ¥í Detection limit
  •   @Bare Wafer / Surface VPD
  •  
  •  Less than 1x107 atoms/cm2
  • ¥í Auto Calibration
  •   @22 element / 15min
  •  
  •  R : 0.997

WCS-M300 Dimension

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