WCS-M300 utilizes ICP-MS(Inductively Coupled Plasma Mass Spectrometry)
for further detecting and characterizing metal trace on wafer surface.
¡¤Agilent sensor used
(others sensors can be adopted).
¡¤Inductively coupled plasma
ionizes the sample.
¡¤Metal contaminant detection can detect
down to one part per trillion
¡¤Detection Limit-1X107
atoms/cm2 on 300mm wafer
¡¤Survey Limit-over 60 elements
in a single survey.