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fTDS(Thermal Desorption Spectroscopy for Semiconductor Wafer)

Wafer real - time measuring diagnosis technology development is based on various academic
foundation and highest level technology, and especially, it requires the integration of fusion
technology and advanced cutting edge convergence technology such as advanced vacuum
technology, impurities measuring diagnosis, extremely pure environment maintenance, process
control, mapping and so on.

  • ¢º Specification

  • ¡¤ Sample Description: ¡Â ¨ª300 mm wafer
  • ¡¤ Mass Range: (1 ~ 512) amu
  • ¡¤ Full Heating: up to 950 ¡É
  • ¡¤ Local Heating: up to 1,400 ¡É
  • ¡¤ Base Pressure:
    * process chamber, 5 × 10-7 mbar
    * measurement chamber, < 5 × 10-9 mbar
  • ¡¤ DAQ System: automated fully, wafer loading to measurement through data analysis
IVT